The International Congress on Architectural Envelopes | Special issue -2018

  • Ulrich Knaack TU Delft, Faculty of Architecture and the Built Environment http://orcid.org/0000-0001-7965-4581
  • Tillmann Klein TU Delft, Faculty of Architecture and the Built Environment http://orcid.org/0000-0001-7883-1953
  • Julen Astudillo Larraz Architect, TECNALIA Research & Innovation
  • Jose Antonio Chica Director del Área de Construcción Industrializada, TECNALIA Research & Innovation

Synopsis

Special edition in collaboration with the International Congress on Architectural Envelopes (www.icae2018.eu), which is organise devery 3 years in San Sebastian (Basque Country, Spain).

The eleven articles found in this issue were carefully selected from 50 abstracts that will be presented during the scientific section of the congress. The final selected papers were subjected to the regular double-blind review process of the journal.

With this selection of papers, we want to give an overview of the traditional technologies that are normally discussed in the context of façades, while also making some mention of new technologies, which, some time ago, existed only in the realm of the laboratory but which have begun to appear in real buildings and construction in recent years. In fact, the main topic of the conference this year is the Envelope 4.0, and consequently the aim of the magazine. Under this title, the aim is to unify two elements: the architectural envelope, due to it being the main reason for holding the conference, and the term “Industry 4.0” as a representation of the need to improve the manufacturing, assembly, distribution, and installation processes of many of the products included in today’s envelopes in order to be competitive in the market.

Cover for The International Congress on Architectural Envelopes | Special issue -2018

Details about this monograph

ISBN-13 (15)
9789463660518
Date of first publication (11)
2018-06-05
Physical Dimensions
216mmx279mm
Rights
Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 International License.